Born2Bond™ UV EE (Epoxy Encapsulation) adhesives are specially formulated for glob top encapsulation of microchips in smart cards and electronic devices. Encapsulation using these advanced solutions protects the chip’s sensitive wire contacts from damage while also providing long-term resistance to moisture, dust and mechanical stress. It can also reduce the risk of security breaches, with the chip being destroyed upon removal.
Single-component, Born2Bond™ UV EE products cure on exposure to UV light, making them ideal for sensitive microchips, while also helping to accelerate production processes and reduce energy consumption, supporting with sustainability initiatives.
Fast-curing properties and specific rheology make Born2Bond™ UV EE adhesives suitable for high-speed automated processes, with no glob top shift (UV EE 3611). While precise dispensing combined with thixotropic properties also ensures the adhesives do not spread beyond the area they are intended to cover – resulting in a fine aesthetic finish and keeping the amount of adhesive required to an absolute minimum.
Always use glasses and gloves when applying adhesives.
| UV EE 3610 | UV EE 3611 | ||
|---|---|---|---|
VISCOSITY @20ºC |
50 rpm / Spindle 5 (mPa.s) | 4,000 to 5,000 | 6,000 to 7,000 |
THIXOTROPIC INDEX* @ 20ºC |
2.1 to 2.2 | 2.4 to 2.6 | |
DENSITY @ 23ºC |
1.4 | ||
FILLER CONTENT (by weight) |
40 | ||
UV CURING (nm UVA) |
365 to 385 | ||
HARDNESS |
78 to 82 D | ||
TENSILE STRENGTH (MPa) |
36 | ||
ELONGATION (%) |
2 to 4 | ||
Tg (ºC) |
70 to 72 | ||
*Thixotropic index = viscosity ratio measured @ 5 rpm vs. 50 rpm / Spindle 5
If you are interested in receiving a sample of any Born2Bond™ products, please complete the form below and choose up to three products that you would like to receive samples of. A member of our team will then get in touch to discuss your needs further.
