Born2Bond
UV EE

Maximizing durability, security and sustainability

Born2Bond UV EE (Epoxy Encapsulation) adhesives are specially formulated for glob top encapsulation of microchips in smart cards and electronic devices. Encapsulation using these advanced solutions protects the chip’s sensitive wire contacts from damage while also providing long-term resistance to moisture, dust and mechanical stress. It can also reduce the risk of security breaches, with the chip being destroyed upon removal.

Single-component, Born2Bond UV EE products cure on exposure to UV light, making them ideal for sensitive microchips, while also helping to accelerate production processes and reduce energy consumption, supporting with sustainability initiatives.

Fast-curing properties and specific rheology make Born2Bond UV EE adhesives suitable for high-speed automated processes, with no glob top shift (UV EE 3611). While precise dispensing combined with thixotropic properties also ensures the adhesives do not spread beyond the area they are intended to cover – resulting in a fine aesthetic finish and keeping the amount of adhesive required to an absolute minimum.


Prise
rapide

Flexible
et élastique

Précision

UV Curing

Plusieurs
viscosités

CARACTÉRISTIQUES

  • Moins friable que les adhésifs instantanés classiques
  • Adhère à une grande variété de matériaux** y compris le polystyrène
  • Transparent et facile à utiliser
  • Temps de prise : 30 secondes*
  • Haute force d'adhérence : > 6 Mpa au bout de 5 min
  • Conservation après ouverture de 25 minutes
  • Comble les écarts allant jusqu'à 5 mm

APPLICATIONS TYPES

  • Assemblage des plastiques
  • Collage structural
  • Collage d'aimants
  • Collage plastique sur métal
  • Collage de verre sur cuir

Portez toujours des lunettes et des gants lorsque vous appliquez des adhésifs.

Spécifications produits

UV EE 3610 UV EE 3611

VISCOSITY @20ºC

50 rpm / Spindle 5 (mPa.s) 4,000 to 5,000 6,000 to 7,000

THIXOTROPIC INDEX* @ 20ºC

2.1 to 2.2 2.4 to 2.6

DENSITY @ 23ºC

1.4

FILLER CONTENT (by weight)

40

UV CURING (nm UVA)

365 to 385

HARDNESS

78 to 82 D

TENSILE STRENGTH (MPa)

36

ELONGATION (%)

2 to 4

Tg (ºC)

70 to 72

*Thixotropic index = viscosity ratio measured @ 5 rpm vs. 50 rpm / Spindle 5

DEMANDEZ DES ÉCHANTILLONS

Si vous souhaitez recevoir des échantillons de produits Born2Bond, veuillez remplir le formulaire ci-dessous et choisir au maximum trois produits que vous aimeriez tester.