Born2Bond
UV EE

Maximizing durability, security and sustainability

Born2Bond UV EE (Epoxy Encapsulation) adhesives are specially formulated for glob top encapsulation of microchips in smart cards and electronic devices. Encapsulation using these advanced solutions protects the chip’s sensitive wire contacts from damage while also providing long-term resistance to moisture, dust and mechanical stress. It can also reduce the risk of security breaches, with the chip being destroyed upon removal.

Single-component, Born2Bond UV EE products cure on exposure to UV light, making them ideal for sensitive microchips, while also helping to accelerate production processes and reduce energy consumption, supporting with sustainability initiatives.

Fast-curing properties and specific rheology make Born2Bond UV EE adhesives suitable for high-speed automated processes, with no glob top shift (UV EE 3611). While precise dispensing combined with thixotropic properties also ensures the adhesives do not spread beyond the area they are intended to cover – resulting in a fine aesthetic finish and keeping the amount of adhesive required to an absolute minimum.


Pegado
rápido

Flexible y
elástico

Precisión

UV Curing

Múltiples
viscosidades

CARACTERÍSTICAS

  • Menos frágil que los adhesivos instantáneos convencionales
  • Adhiere una amplia gama de materiales**, incluido el poliestireno
  • Transparente y fácil de usar
  • Tiempo de fijación de 30 segundos*
  • Alta fuerza de adhesión: >6 MPa tras 5 minutos
  • Tiempo abierto de 25 minutos
  • Rellena holguras de hasta 5 mm

APLICACIONES HABITUALES

  • Montaje de plástico
  • Adhesión estructural
  • Adhesión de imanes
  • Adhesión de plástico a metal
  • Adhesión de vidrio a cuero

Lleve siempre gafas y guantes cuando aplique adhesivos

Especificaciones del producto

UV EE 3610 UV EE 3611

VISCOSITY @20ºC

50 rpm / Spindle 5 (mPa.s) 4,000 to 5,000 6,000 to 7,000

THIXOTROPIC INDEX* @ 20ºC

2.1 to 2.2 2.4 to 2.6

DENSITY @ 23ºC

1.4

FILLER CONTENT (by weight)

40

UV CURING (nm UVA)

365 to 385

HARDNESS

78 to 82 D

TENSILE STRENGTH (MPa)

36

ELONGATION (%)

2 to 4

Tg (ºC)

70 to 72

*Thixotropic index = viscosity ratio measured @ 5 rpm vs. 50 rpm / Spindle 5

SOLICITE MUESTRAS

Si desea recibir una muestra de alguno de los productos Born2Bond, rellene el siguiente formulario y elija hasta un máximo de tres productos.