Born2Bond
UV EE

Maximizing durability, security and sustainability

Born2Bond UV EE (Epoxy Encapsulation) adhesives are specially formulated for glob top encapsulation of microchips in smart cards and electronic devices. Encapsulation using these advanced solutions protects the chip’s sensitive wire contacts from damage while also providing long-term resistance to moisture, dust and mechanical stress. It can also reduce the risk of security breaches, with the chip being destroyed upon removal.

Single-component, Born2Bond UV EE products cure on exposure to UV light, making them ideal for sensitive microchips, while also helping to accelerate production processes and reduce energy consumption, supporting with sustainability initiatives.

Fast-curing properties and specific rheology make Born2Bond UV EE adhesives suitable for high-speed automated processes, with no glob top shift (UV EE 3611). While precise dispensing combined with thixotropic properties also ensures the adhesives do not spread beyond the area they are intended to cover – resulting in a fine aesthetic finish and keeping the amount of adhesive required to an absolute minimum.


快速粘接

柔韧 弹性

精确

UV Curing

多种粘度

特性

  • 相较传统瞬干胶而言更不易碎
  • 可粘接多种材料**,包括聚苯乙烯
  • 透明且易于使用
  • 30秒固定时间*
  • 高粘合强度:粘合5分钟后粘度?/压力?大于6 MPa
  • 开放时间达到25分钟
  • 最大可填充间隙5mm

典型应用

  • 塑料组装
  • 结构性粘接
  • 磁体粘合
  • 塑料与金属粘接
  • 玻璃粘合到皮革

涂装胶粘剂时,务必佩戴眼镜和手套。

产品规格

UV EE 3610 UV EE 3611

VISCOSITY @20ºC

50 rpm / Spindle 5 (mPa.s) 4,000 to 5,000 6,000 to 7,000

THIXOTROPIC INDEX* @ 20ºC

2.1 to 2.2 2.4 to 2.6

DENSITY @ 23ºC

1.4

FILLER CONTENT (by weight)

40

UV CURING (nm UVA)

365 to 385

HARDNESS

78 to 82 D

TENSILE STRENGTH (MPa)

36

ELONGATION (%)

2 to 4

Tg (ºC)

70 to 72

*Thixotropic index = viscosity ratio measured @ 5 rpm vs. 50 rpm / Spindle 5

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