Born2Bond
UV-CIPG Gasketing

Addressing the challenges associated with traditional gaskets

A step forward

Bostik’s Born2Bond UV Cure-In-Place Gasket (UV-CIPG) range signals another step forward in the development of engineering adhesives. Extremely flexible and tough, the strength and elongation of these UV-CIPG Gasketing solutions enable production of waterproof and dustproof products with gaskets that do not crack when compressed or deformed, and which can withstand exposure to temperature fluctuations and chemicals.

Quicker than traditional methods of hand assembling cut or molded rubber gaskets, high-precision dispensing options reduce the costs and inaccuracies associated with such labour-intensive processes. They also eliminate the need for investment in expensive and space-consuming equipment such as molds and ovens – while immediate UV ray curing removes the risk of heat damage and accelerates production.

HIGH
PERFORMANCE

REDUCED PRODUCTION COSTS

INCREASED THROUGHPUT

Molded and cut gaskets Heat- and humidity-cure gaskets Born2Bond
UV-CIPG solutions
Labor intensity
Defect rate
Floorspace required
Automation

Poor

Moderate

Excellent

Offering precision, versatility and longevity, Born2Bond UV-CIPG Gasketing solutions are suitable for use in a variety of industries, including but not limited to, Automotive and Electronics.

COMING SOON

New Born2Bond
products will
be coming soon.