Born2Bond™
UV-CIPG AU Series
Reduce costs and make more, more easily
Addressing the challenges associated with traditional gaskets
Bostik’s Born2Bond™ UV Cure-In-Place Gasket (UV-CIPG) range signals another step forward in the development of engineering adhesives. Extremely flexible and tough, the strength and elongation of these UV-CIPG Gasketing solutions enable production of waterproof and dustproof products with gaskets that do not crack when compressed or deformed, and which can withstand exposure to temperature fluctuations and chemicals.
Quicker than traditional methods of hand assembling cut or molded rubber gaskets, high-precision dispensing options reduce the costs and inaccuracies associated with such labour-intensive processes. They also eliminate the need for investment in expensive and space-consuming equipment such as molds and ovens – while immediate UV ray curing removes the risk of heat damage and accelerates production.
| Molded and cut gaskets | Heat- and humidity-cure gaskets | Born2Bond™ UV-CIPG solutions |
|
|---|---|---|---|
| Labor intensity | |||
| Defect rate | |||
| Floorspace required | |||
| Automation |
Poor
Moderate
Excellent
Offering precision, versatility and longevity, Born2Bond™ UV-CIPG Gasketing solutions are suitable for use in a variety of industries, including but not limited to, Automotive and Electronics.
New Born2Bond™
products will
be coming soon.