Born2Bond
UV EE

Maximizing durability, security and sustainability

Born2Bond UV EE (Epoxy Encapsulation) adhesives are specially formulated for glob top encapsulation of microchips in smart cards and electronic devices. Encapsulation using these advanced solutions protects the chip’s sensitive wire contacts from damage while also providing long-term resistance to moisture, dust and mechanical stress. It can also reduce the risk of security breaches, with the chip being destroyed upon removal.

Single-component, Born2Bond UV EE products cure on exposure to UV light, making them ideal for sensitive microchips, while also helping to accelerate production processes and reduce energy consumption, supporting with sustainability initiatives.

Fast-curing properties and specific rheology make Born2Bond UV EE adhesives suitable for high-speed automated processes, with no glob top shift (UV EE 3611). While precise dispensing combined with thixotropic properties also ensures the adhesives do not spread beyond the area they are intended to cover – resulting in a fine aesthetic finish and keeping the amount of adhesive required to an absolute minimum.


Schnelle
Bindung

Flexibel
& elastisch

Präzision

UV Curing

Mehrere
Viskositäten

MERKMALE

  • Single component solutions
  • Available in multiple viscosities
  • No hard settlement, resulting in reduced wastage/blockages
  • Suitable for high precision and high-speed automated dispensing (no glob top shift at 16,000 UPH with UV EE 3611)
  • Extremely flexible and durable - withstanding more than 5,000 cycles of following tests - Dynamic torsional stress, Dynamic bending stress, Shortened bending, 3 wells testing
  • High resistance to thermal cycling
  • Excellent temperature & humidity resistance

TYPISCHE ANWENDUNGSBEREICHE

  • SIM cards
  • Bank and payment cards
  • Identification cards
  • Security access cards
  • Electronic devices

Beim Auftragen von Klebstoffen immer Schutzbrille und Schutzhandschuhe tragen

Produktspezifikation

UV EE 3610 UV EE 3611

VISCOSITY @20ºC

50 rpm / Spindle 5 (mPa.s) 4,000 to 5,000 6,000 to 7,000

THIXOTROPIC INDEX* @ 20ºC

2.1 to 2.2 2.4 to 2.6

DENSITY @ 23ºC

1.4

FILLER CONTENT (by weight)

40

UV CURING (nm UVA)

365 to 385

HARDNESS

78 to 82 D

TENSILE STRENGTH (MPa)

36

ELONGATION (%)

2 to 4

Tg (ºC)

70 to 72

*Thixotropic index = viscosity ratio measured @ 5 rpm vs. 50 rpm / Spindle 5

MUSTER ANFORDERN

Wenn Sie an Mustern der Born2Bond -Produkte interessiert sind, füllen Sie bitte folgendes Formular aus und wählen Sie bis zu drei Produkte, die Sie gern als Muster erhalten möchten. Ein Mitglied unseres Teams wird sich dann mit Ihnen in Verbindung setzen, um Ihre Bedürfnisse weiter zu besprechen.