Born2Bond
UV EE

Maximizing durability, security and sustainability

Born2Bond UV EE (Epoxy Encapsulation) adhesives are specially formulated for glob top encapsulation of microchips in smart cards and electronic devices. Encapsulation using these advanced solutions protects the chip’s sensitive wire contacts from damage while also providing long-term resistance to moisture, dust and mechanical stress. It can also reduce the risk of security breaches, with the chip being destroyed upon removal.

Single-component, Born2Bond UV EE products cure on exposure to UV light, making them ideal for sensitive microchips, while also helping to accelerate production processes and reduce energy consumption, supporting with sustainability initiatives.

Fast-curing properties and specific rheology make Born2Bond UV EE adhesives suitable for high-speed automated processes, with no glob top shift (UV EE 3611). While precise dispensing combined with thixotropic properties also ensures the adhesives do not spread beyond the area they are intended to cover – resulting in a fine aesthetic finish and keeping the amount of adhesive required to an absolute minimum.


빠른 접착

유연성
탄력성

정밀성

UV Curing

다양한 점도

특징

  • Single component solutions
  • Available in multiple viscosities
  • No hard settlement, resulting in reduced wastage/blockages
  • Suitable for high precision and high-speed automated dispensing (no glob top shift at 16,000 UPH with UV EE 3611)
  • Extremely flexible and durable - withstanding more than 5,000 cycles of following tests - Dynamic torsional stress, Dynamic bending stress, Shortened bending, 3 wells testing
  • High resistance to thermal cycling
  • Excellent temperature & humidity resistance

일반적인 응용 분야

  • SIM cards
  • Bank and payment cards
  • Identification cards
  • Security access cards
  • Electronic devices

접착제 사용 시 언제나 보안경과 장갑을 착용하십시오

제품 사양

UV EE 3610 UV EE 3611

VISCOSITY @20ºC

50 rpm / Spindle 5 (mPa.s) 4,000 to 5,000 6,000 to 7,000

THIXOTROPIC INDEX* @ 20ºC

2.1 to 2.2 2.4 to 2.6

DENSITY @ 23ºC

1.4

FILLER CONTENT (by weight)

40

UV CURING (nm UVA)

365 to 385

HARDNESS

78 to 82 D

TENSILE STRENGTH (MPa)

36

ELONGATION (%)

2 to 4

Tg (ºC)

70 to 72

*Thixotropic index = viscosity ratio measured @ 5 rpm vs. 50 rpm / Spindle 5

샘플 요청

Born2Bond 제품에 관심이 있다면 아래 양식을 작성하고 샘플을 받고 싶은 제품을 3개까지 선택하십시오. 그러면 우리 팀의 구성원이 귀하의 요구 사항에 대해 추가로 논의하기 위해 연락을 드릴 것입니다.