Born2Bond
MP515

Fastest structural 2K CA with high heat resistance

MP515

High-strength, two-part, instant adhesive

Born2Bond MP515 is a patented †, gap filling, instant structural adhesive with excellent adhesion to a very broad range of materials and surfaces, including aluminum. This product has improved temperature and humidity resistance and offers working times of between 5 and 10 minutes. The transparent gel consistency enables application in any orientation, while the static mixing nozzle ensures uniform and precise application for exceptional user convenience.

Gap<br /> Filling icon
Gap
Filling
High Temperature Resistance icon
High Temperature Resistance
High<br /> Strength icon
High
Strength
Multi-substrate<br /> Adhesion icon
Multi-substrate
Adhesion
Precision icon
Precision

FEATURES

  • Fixture time of 30 seconds*
  • High adhesion strength
  • Open time of 5 minutes
  • Fills gaps up to 5mm
  • Excellent adhesion to many different substrates**
  • Transparent when cured
  • Temperature and humidity resistance
  • Gel consistency for precise application

TYPICAL APPLICATIONS

  • Structural bonding
  • Magnet bonding
  • Bathroom accessory bonding
  • Automotive and aftermarket applications

*Depending on gaps and substrates.
**Except polyolefins.
Always use glasses and gloves when applying adhesives.

Product Specification

MP515
BASE Ethyl Cyanoacrylate/
Multifunctional Acrylates
VISCOSITY at 25 (mPa.s) Part A: 120.000 to 180.000
Part B: 40.000 to 70.000
OPEN TIME (minutes) 5
FIXTURE TIME* (seconds) 30 to 140
BOND STRENGTH (MPa) Grit-Blasted Mild Steel - 18 to 23
APPEARANCE Transparent
TEMPERATURE RANGE -40ºC to +120ºC (-40ºF to +248ºF)
GAP FILLING CAPABILITY (mm) 5
AVAILABLE IN Syringes: 10g, 50g

† Patented in multiple countries

REQUEST SAMPLES

If you are interested in receiving a sample of any Born2Bond products, please complete the form below and choose up to three products that you would like to receive samples of. A member of our team will then get in touch to discuss your needs further.