Bostik has extended its Born2Bond™ engineering adhesive HMPUR and UV-CIPG ranges to support the manufacture of smaller, more lightweight and increasingly complex consumer electronic devices that are also required to be recyclable and meet all relevant sustainability and safety regulations.
Five new products have been added to Born2Bond™'s high-performance HMPUR (Hot Melt Polyurethane Reactive) range to deliver precision, durability and speed of application. The range is flexible and elastic, delivers high bonding strength on multiple substrates, including plastic, glass and metal, and is available in multiple viscosities.
The new high-performance HMPUR products are suited to structural parts bonding, touch panel bonding, acoustic assembly and auto display, ideal for applications such as headphones, smartwatches, laptop keyboards, smartphones, tablets, speakers, wearables, drones and games consoles. Good ageing resistance and excellent humidity, sebum, temperature, chemical and impact resistance, also support durability and longevity requirements.
The UV-CIPG (UV Cure-In-Place Gaskets) range has been extended with two additional products to provide serviceable gasketing solutions that help to protect consumer electronics from dust and liquids. The new solutions provide greater design flexibility without the need to create new molds required for traditional gaskets. They also deliver high durability with thermal and humidity resistance and conveniently change colour during the curing process.
To address the issue of sustainability, both ranges have been specifically designed for auto dispensing, providing precision application and high-production efficiency, reducing wastage and costs. Engineering adhesives and UV cure-in-place gaskets also deliver low-energy application processes, support preventative maintenance, and enable the rework-ability and recyclability of consumer electronics. They also help provide increased user comfort, meeting the needs of increasingly stringent safety regulations.
Stephen Edwards, Business Director APAC of Engineering Adhesives at Bostik, says the business is focused on the needs of consumer electronics designers and manufacturers in the development of all new adhesives:
“We extended the UV-CIPG range, for example, because we felt for too long the consumer electronics industry have felt the significant drawbacks of traditional gasketing solutions such as low performance and high production costs. Our Born2Bond™ engineering adhesives are delivering high-performance solutions to these challenges, as well as providing manufacturers with more adaptable and faster processes,” he says.
“We also have the capability to develop tailor-made solutions depending on the specific need of the manufacturer. Our teams relish a new challenge!”
The new HMPUR products are Born2Bond™ HHD 5510, HHD 5518BK, HHD 5529, HHD 5539 and HHD 6103BK. The new UV-CIPG products are Born2Bond™ AU060R and AU589V.
Bostik at Productronica China 2023
Bostik is to participate at Productronica China 2023 - one of the leading trade fairs for innovative electronics manufacturing. Taking place 13th-15th April at the Shanghai International Expo Centre (SNIEC), the Bostik Engineering Adhesives team will showcase the latest Born2Bond™ products and solutions for the electronics industry, including the extended HMPUR and UV-CIPG ranges. Find Bostik at booth W5.5658.