Meeting the needs of modern-day production processes
Epoxy adhesives have long been used for structural bonding applications across a wide range of industries, but they typically lack the precision, sensitivity and production efficiencies required for more specialist, high performance applications, such as dam & fill and glob top encapsulation of microchips in smart cards and electronic devices.
Born2Bond™ UV-Epoxy adhesives are high-precision cationic epoxy solutions that cure on exposure to UV light. The ability to cure without high temperatures can be of particular benefit for items containing sensitive components that would be compromised by heat. UV curing can also accelerate production processes and reduce energy consumption, therefore contributing to a manufacturer’s sustainability credentials.